K4B2G0846D-HYF8

Product Overview

IC Picture

Images are for reference only

Manufacturer Part No K4B2G0846D-HYF8
Brand SAMSUNG
Item DDR3L SDRAM
Part No 256MX8 DDR3L

Product Details

Package FBGA-78
Outpack
RoHS RoHS
Voltage 1.35 V
Temperature 0 C~+85 C
Speed 1066 MBPS
Std. Pack Qty
Std. Carton
Number Of Words 256M
Bit Organization x8
Density 2G
Internal Banks 8 Banks
Power Low VDD(1.35V)
Generation 5th Generation

Available Offers

Description Qty Datecode
K4B2G0846D-HYF8 4,000 Get Quote
K4B2G0846D-HYF8 2,000 2009+ Get Quote

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
H5TC2G83BFR-G7A FBGA-78 1.35V 1066 MBPS 0 C~+85 C
H5TC2G83CFR-G7A FBGA-78 1.35V 1066 MBPS 0 C~+85 C
H5TC2G83DFR-G7C FBGA-78 1.35V 1066 MBPS 0 C~+85 C
H5TC2G83EFR-G7A FBGA-78 1.35V 1066 MBPS 0 C~+85 C
K4B2G0846B-HYF8 FBGA-78 1.35 V 1066 MBPS 0 C~+85 C
K4B2G0846C-HYF8 FBGA-78 1.35 V 1066 MBPS 0 C~+85 C
K4B2G0846C-HYF8000 FBGA-78 1.35 V 1066 MBPS 0 C~+85 C