K4M561633G-BN75 IC
Product Overview
Images are for reference only
| Manufacturer Part No | K4M561633G-BN75 IC |
| Brand | SAMSUNG |
| Item | SDRAM MOBILE |
| Part No | 16MX16 SD |
Product Details
| Package | BGA |
| Outpack | |
| RoHS | Leaded |
| Voltage | 3.0V/3.3V |
| Temperature | -25 C~+85 C |
| Speed | 133 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 16M |
| Bit Organization | x16 |
| Density | 256M |
| Internal Banks | 4 Banks |
| Power | Low, i-TCSR |
| Generation | 8th Generation |
Available Offers
| Description | Qty | Datecode | |
|---|---|---|---|
| K4M561633G-BN75 IC | 4,848 | 06+ | Get Quote |
FFFE (Form, Fit & Functional Equivalents)
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| K4S561633F-XN75 | BGA | 3.3 V | 133 MHZ | -25 C~+85 C |
| K4S561633F-XN75000 | BGA | 3.3 V | 133 MHZ | -25 C~+85 C |
| K4S561633F-XN75T00 | BGA | 3.3 V | 133 MHZ | -25 C~+85 C |