K4M561633HBG-75

Product Overview

IC Picture

Images are for reference only

Manufacturer Part No K4M561633HBG-75
Brand SAMSUNG
Item SDRAM MOBILE
Part No 16MX16 SD

Product Details

Package FBGA
Outpack
RoHS RoHS
Voltage 3.0V/3.3V
Temperature -25 C~+85 C
Speed 133 MHZ
Std. Pack Qty
Std. Carton
Number Of Words 16M
Bit Organization x16
Density 256M
Internal Banks 4 Banks
Power Low, i-TCSR & PASR & DS
Generation 9th Generation

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
K4M561633K-BN75 FBGA 3.0V/3.3V 133 MHZ -25 C~+85 C
K4S561633-CBN75 FBGA 3.3 V 133 MHZ -25 C~+85 C
K4S561633F-FN75 FBGA 3.3 V 133 MHZ -25 C~+85 C
K4S561633F-ZE75 FBGA 3.3 V 133 MHZ -25 C~+85 C
K4S561633F-ZG75 FBGA 3.3 V 133 MHZ -25 C~+85 C
K4S561633F-ZN75 FBGA 3.3 V 133 MHZ -25 C~+85 C
K4S561633F-ZN75T00 FBGA 3.3 V 133 MHZ -25 C~+85 C
K4S561633G-BN75 FBGA 3.3 V 133 MHZ -25 C~+85 C
K4S56163LCBG75 FBGA 3.3 V 133 MHZ -25 C~+85 C
K4S56163LF-ZE75 FBGA 3.3 V 133 MHZ -25 C~+85 C