K4S56163LCBG75

Product Overview

IC Picture

Images are for reference only

Manufacturer Part No K4S56163LCBG75
Brand SAMSUNG
Item SDRAM
Part No 16MX16 SD

Product Details

Package FBGA
Outpack
RoHS Leaded
Voltage 3.3 V
Temperature -25 C~+85 C
Speed 133 MHZ
Std. Pack Qty
Std. Carton
Number Of Words 16M
Bit Organization x16
Density 256M
Internal Banks 4 Banks
Power Low, i-TCSR & PASR & DS
Generation 4th Generation

Available Offers

Description Qty Datecode
K4S56163LCBG75 1,000 Get Quote

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
K4M561633HBG-75 FBGA 3.0V/3.3V 133 MHZ -25 C~+85 C
K4M561633K-BN75 FBGA 3.0V/3.3V 133 MHZ -25 C~+85 C
K4S561633-CBN75 FBGA 3.3 V 133 MHZ -25 C~+85 C
K4S561633F-FN75 FBGA 3.3 V 133 MHZ -25 C~+85 C
K4S561633F-ZE75 FBGA 3.3 V 133 MHZ -25 C~+85 C
K4S561633F-ZG75 FBGA 3.3 V 133 MHZ -25 C~+85 C
K4S561633F-ZN75 FBGA 3.3 V 133 MHZ -25 C~+85 C
K4S561633F-ZN75T00 FBGA 3.3 V 133 MHZ -25 C~+85 C
K4S561633G-BN75 FBGA 3.3 V 133 MHZ -25 C~+85 C
K4S56163LF-ZE75 FBGA 3.3 V 133 MHZ -25 C~+85 C