K4UBE3D4AM-GUCL

Product Overview

IC Picture

Images are for reference only

Manufacturer Part No K4UBE3D4AM-GUCL
Brand SAMSUNG
Item LPDDR4X SDRAM
Part No 1GX32 LPDDR4

Product Details

Package FBGA-200
Outpack
RoHS RoHS
Voltage 0.6 V
Temperature -25 C~+85 C
Speed 4266 MBPS
Std. Pack Qty
Std. Carton

Cross Reference

Description Package Voltage Speed Temperature
MT53D1024M32D4DT-046 AUT:D VFBGA-200 1.1 V 4266 MBPS -40 C~+125 C

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
H9HCNNNCPMMLXR-NE FBGA-200 0.6 V 4266 MBPS -25 C~+85 C
H9HCNNNCPMMLXR-NEE FBGA-200 0.6 V 4266 MBPS -25 C~+85 C
H9HCNNNCPMMLXR-NEER FBGA-200 0.6 V 4266 MBPS -25 C~+85 C
K4UBE3D4AA-MGC FBGA-200 0.6 V 4266 MBPS -25 C~+85 C
K4UBE3D4AA-MGCL FBGA-200 0.6 V 4266 MBPS -25 C~+85 C
K4UBE3D4AA-MGCL/FBGA200 FBGA-200 0.6 V 4266 MBPS -25 C~+85 C
K4UBE3D4AA-MGCL000 FBGA-200 0.6 V 4266 MBPS -25 C~+85 C
K4UBE3D4AA-MGCL0UT FBGA-200 0.6 V 4266 MBPS -25 C~+85 C
K4UBE3D4AA-MGCLT00 FBGA-200 0.6 V 4266 MBPS -25 C~+85 C
K4UBE3D4AA-MGCLTUT FBGA-200 0.6 V 4266 MBPS -25 C~+85 C