K4UHE3D4AA-GFCL

Product Overview

IC Picture

Images are for reference only

Manufacturer Part No K4UHE3D4AA-GFCL
Brand SAMSUNG
Item LPDDR4X SDRAM
Part No 512MX32 LPDDR4

Product Details

Package FBGA-200
Outpack
RoHS RoHS
Voltage 1.1 V
Temperature -40 C~+105 C
Speed 4266 MBPS
Std. Pack Qty
Std. Carton

Cross Reference

Description Package Voltage Speed Temperature
MT53E768M32D4DT-046 AIT:E VFBGA-200 1.1 V 4266 MBPS -40 C~+95 C

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
K4UHE3D4AA-GUCL FBGA-200 1.1 V 4266 MBPS -40 C~+105 C
K4UHE3D4AA-TFCL FBGA-200 1.1 V 4266 MBPS -40 C~+105 C
K4UHE3D4AA-TFCL03V CS FBGA-200 1.1 V 4266 MBPS -40 C~+105 C
MT53D512M32D2DS-046 AAT:D WFBGA-200 1.1 V 4266 MBPS -40 C~+105 C
MT53D512M32D2DS-046 AAT:D T R WFBGA-200 1.1 V 4266 MBPS -40 C~+105 C
MT53D512M32D2DS-046-AAT WFBGA-200 1.1 V 4266 MBPS -40 C~+105 C
MT53D512M32D2DS-046AAT:D IC WFBGA-200 1.1 V 4266 MBPS -40 C~+105 C
MT53D512M32D2DS-046AATDT ... WFBGA-200 1.1 V 4266 MBPS -40 C~+105 C
MT53D512M32D2NP-046 AAT ES:D WFBGA-200 1.1 V 4266 MBPS -40 C~+105 C
MT53D512M32D2NP-046 AAT:D WFBGA-200 1.1 V 4266 MBPS -40 C~+105 C