MT29F32G08CBABAL63BWC1

Product Overview

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Manufacturer Part No MT29F32G08CBABAL63BWC1
Brand MICRON
Item FLASH-NAND
Part No 4GX8 NAND MLC

Product Details

Package TSOP
Outpack
RoHS RoHS
Voltage 3.3 V
Temperature 0 C~+70 C
Speed 1 MHZ
Std. Pack Qty
Std. Carton
Number Of Words 4G
Bit Organization x8
Density 32G
Production Status Production
Package Material Pb-free
Interface Async only
Level MLC-2
Generation Feature Set 2nd set of device features (rev only if different than 1st set)
Speed Grade Async only
Design Revision W
Classification 1-1-1-1 (Die-nCE-RnB-IO Channels)

General Description Micron NAND Flash devices include an asynchronous data interface for high-performance I/O operations. These devices use a highly multiplexed 8-bit bus (DQx) to transfer commands, address, and data. There are five control signals used to implement the asynchronous data interface: CE#, CLE, ALE, WE#, and RE#. Additional signals control hardware write protection (WP#) and monitor device status (R/B#). This Micron NAND Flash device additionally includes a synchronous data interface for high-performance I/O operations. When the synchronous interface is active, WE# becomes CLK and RE# becomes W/R#. Data transfers include a bidirectional data strobe (DQS). This hardware interface creates a low pin-count device with a standard pinout that remains the same from one density to another, enabling future upgrades to higher densities with no board redesign. A target is the unit of memory accessed by a chip enable signal. A target contains one or more NAND Flash die. A NAND Flash die is the minimum unit that can independently execute commands and report status. A NAND Flash die, in the ONFI specification, is referred to as a logical unit (LUN). For further details, see Device and Array Organization.

Available Offers

Description Qty Datecode
MT29F32G08CBABAL63BWC1 62,000 Get Quote
MT29F32G08CBABAL63BWC1 24,000 Get Quote
MT29F32G08CBABAL63BWC1 100,000 Get Quote
MT29F32G08CBABAL63BWC1 100,000 09+ Get Quote
MT29F32G08CBABAL63BWC1 100,000 Get Quote
MT29F32G08CBABAL63BWC1 42,000 Get Quote

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
H27UBG8T2BTR -BC TSOP 2.7V-3.6V 1 MHZ 0 C~+70 C
H27UBG8U5MTR-B TSOP 2.7V-3.6V 1 MHZ 0 C~+70 C
H27UBG8U5MTR-BC TSOP 2.7V-3.6V 1 MHZ 0 C~+70 C
MT29F32G08BAAAWC TSOP 3.3 V 1 MHZ 0 C~+70 C
MT29F32G08CBAAA TSOP 3.3 V 1 MHZ 0 C~+70 C
MT29F32G08CBAAAL63A3WC1 TSOP 3.3 V 1 MHZ 0 C~+70 C
MT29F32G08CBAAAW TSOP 3.3 V 1 MHZ 0 C~+70 C
MT29F32G08CBABAL63B3WC1 TSOP 3.3 V 1 MHZ 0 C~+70 C
MT29F32G08CBACAL73AWC1 TSOP 3.3 V 1 MHZ 0 C~+70 C
MT29F32G08MAAC8 ES:A TSOP 3.3 V 1 MHZ 0 C~+70 C