S70FL256P0XBFI200
Product Details
| Package | BGA-24 |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.0V |
| Temperature | -40 C~+85 C |
| Speed | 104MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Density | 56M |
| Product Series | Dual Die Flash Package |
| Package Material | Lead (Pb)-Free |
| Process Technology | 90nm, MirrorBit Technology |
| Flash Interface | Serial (SPI) |
| Simultaneous Read Write | No |
| Model Number | 20 |
| Package Type | Tray |
| Data Rate | SDR, <100 MHz |
Available Offers
| Description | Qty | Datecode | |
|---|---|---|---|
| S70FL256P0XBFI200 | 30,000 | Get Quote |
FFFE (Form, Fit & Functional Equivalents)
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| S70FL256P0XBHI200 | BGA-24 | 3.0V | 104MHZ | -40 C~+85 C |
| S70FL256P0XBHI203 | BGA-24 | 3.0V | 104MHZ | -40 C~+85 C |
| S70FL256P0XBHI210 | BGA-24 | 3.0V | 104MHZ | -40 C~+85 C |