TH58NYG2S3HBA14

Product Overview

IC Picture

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Manufacturer Part No TH58NYG2S3HBA14
Brand KIOXIA
Item FLASH-NAND
Part No 512MX8 NAND SLC

Product Details

Package BGA-63
Outpack
RoHS RoHS
Voltage 1.8 V
Temperature 0 C~+70 C
Speed 25 NS
Std. Pack Qty
Std. Carton
Number Of Words 64M
Bit Organization x8
Density 512M
Mono Stack Multi Chip
Nand Type NAND
Cell Level 2 Level( 1 bits/cell )
Page Size 2KB
Design Rule 24nm B-type
Package Size TSOP[mm]: Reserved, LGA[mm]: 52 lands, 12 x 17 x 1.04/1.0, BGA[mm]: 132 balls( Toggle ), 12x18x1.85
Package Material Lead-Free: No, Halogen-Free: No
Channel Single / Dual, # of CE 8
Block Size 128KB

Available Offers

Description Qty Datecode
TH58NYG2S3HBA14 6,000 Get Quote

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
MT29F4G08ABBDAH4 VFBGA-63 1.8 V 25 NS 0 C~+70 C
MT29F4G08ABBDAH4:D VFBGA-63 1.8 V 25 NS 0 C~+70 C
MT29F4G08ABBDAH4:D TR VFBGA-63 1.8 V 25 NS 0 C~+70 C
MT29F4G08ABBDAH4D VFBGA-63 1.8 V 25 NS 0 C~+70 C
MT29F4G08ABBDAH4DTR VFBGA-63 1.8 V 25 NS 0 C~+70 C
MT29F4G08ABBDAH4ES:D VFBGA-63 1.8 V 25 NS 0 C~+70 C
MT29F4G08ABBDAH5:D VFBGA-63 1.8 V 25 NS 0 C~+70 C
MT29F4G08ABBDAHC VFBGA-63 1.8 V 25 NS 0 C~+70 C
MT29F4G08ABBDAHC:D VFBGA-63 1.8 V 25 NS 0 C~+70 C
MT29F4G08ABBDAHC:D TR VFBGA-63 1.8 V 25 NS 0 C~+70 C