W25Q128JVCIM

Product Overview

IC Picture

Images are for reference only

Manufacturer Part No W25Q128JVCIM
Brand WINBOND
Item FLASH-QSPI-NOR
Part No 128MB SPI

Product Details

Package TFBGA-24
Outpack
RoHS RoHS
Voltage 2.7V~3.6V
Temperature -40 C~+85 C
Speed 133 MHZ
Std. Pack Qty
Std. Carton
Density 128M
Product Family SpiFlash serial flash memory with 4 KB sectors, Dual/Quad I/O
Product Number Density 128 Mbit
Special Options green package (Lead-free, RoHS compliant, Halogen-free(TBBA), Antimony-Oxide-free Sb2O3) & optimized for mobile applications
Company Prefix winbond

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
S25FL128SAGBHI303 BGA-24 3.0 V 133 MHZ -40 C~+85 C
S25FL128SAGBHI310 BGA-24 3.0 V 133 MHZ -40 C~+85 C
S25FL128SAGBHIA00 BGA-24 3.0 V 133 MHZ -40 C~+85 C
S25FL128SAGBHIA00 , S25FL128SA BGA-24 3.0 V 133 MHZ -40 C~+85 C
S25FL128SAGBHIA03 BGA-24 3.0 V 133 MHZ -40 C~+85 C
S25FL128SAGBHIA1 BGA-24 3.0 V 133 MHZ -40 C~+85 C
S25FL128SAGBHIA10 BGA-24 3.0 V 133 MHZ -40 C~+85 C
S25FL128SAGBHIA13 BGA-24 3.0 V 133 MHZ -40 C~+85 C
S25FL128SAGBHIZ00 BGA-24 3.0 V 133 MHZ -40 C~+85 C
S25FL128SAGBHVA00 BGA-24 3.0 V 133 MHZ -40 C~+85 C