HY5V56FFP-H
产品详情
| 脚位/封装 | FBGA |
| 外包装 | TRAY |
| 无铅/环保 | 含铅 |
| 电压(伏) | 3.3 V |
| 温度规格 | 0 C~+70 C |
| 速度 | 133MHz, CL3 3-3-3 |
| 标准包装数量 | |
| 标准外箱 | |
| Number Of Words | 16M |
| Bit Organization | x16 |
| Density | 256M |
| Package Material | Lead free |
| Hynix Memory | HY |
| Die Generation | 1st Gen. |
| Shipping Method | tray |
供应链有货
| IC 编号 | 数量 | 生产年份 | |
|---|---|---|---|
| HY5V56FFP-H-C | 3,200 | 08+ | 索取报价 |
| HY5V56FFP-H-C | 10,000 | 0815 | 索取报价 |
| HY5V56FFP-H-A | 20,000 | 2011+ | 索取报价 |
| HY5V56FFP-H-C | 10,000 | 索取报价 | |
| HY5V56FFP-H-C | 1,787 | 200846+ | 索取报价 |
| HY5V56FFP-H | 1,428 | 200746+ | 索取报价 |
| HY5V56FFP-H-C | 2,999 | 200846+ | 索取报价 |
| HY5V56FFP-H | 6,000 | 索取报价 | |
| HY5V56FFP-H-A | 11,200 | 索取报价 | |
| HY5V56FFP-H-C | 1,384 | 2010 | 索取报价 |