| 脚位/封装 | FBGA |
| 外包裝 | TRAY |
| 無鉛/環保 | 含鉛 |
| 電壓(伏) | 3.3 V |
| 溫度規格 | 0 C~+70 C |
| 速度 | 133MHz, CL3 3-3-3 |
| 標準包裝數量 | |
| 標準外箱 | |
| Number Of Words | 16M |
| Bit Organization | x16 |
| Density | 256M |
| Package Material | Lead free |
| Hynix Memory | HY |
| Die Generation | 1st Gen. |
| Shipping Method | tray |
| IC 編號 | 數量 | 生產年份 | |
|---|---|---|---|
| HY5V56FFP-H-C | 3,200 | 08+ | 索取報價 |
| HY5V56FFP-H-C | 10,000 | 0815 | 索取報價 |
| HY5V56FFP-H-A | 20,000 | 2011+ | 索取報價 |
| HY5V56FFP-H-C | 10,000 | 索取報價 | |
| HY5V56FFP-H-C | 1,787 | 200846+ | 索取報價 |
| HY5V56FFP-H | 1,428 | 200746+ | 索取報價 |
| HY5V56FFP-H-C | 2,999 | 200846+ | 索取報價 |
| HY5V56FFP-H | 6,000 | 索取報價 | |
| HY5V56FFP-H-A | 11,200 | 索取報價 | |
| HY5V56FFP-H-C | 1,384 | 2010 | 索取報價 |