| Package | FBGA |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.3 V |
| Temperature | 0 C~+70 C |
| Speed | 133MHz, CL3 3-3-3 |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 16M |
| Bit Organization | x16 |
| Density | 256M |
| Package Material | Lead free |
| Hynix Memory | HY |
| Die Generation | 1st Gen. |
| Shipping Method | tray |
| Description | Qty | Datecode | |
|---|---|---|---|
| HY5V56FFP-H-C | 3,200 | 08+ | Get Quote |
| HY5V56FFP-H-C | 10,000 | 0815 | Get Quote |
| HY5V56FFP-H-A | 20,000 | 2011+ | Get Quote |
| HY5V56FFP-H-C | 10,000 | Get Quote | |
| HY5V56FFP-H-C | 1,787 | 200846+ | Get Quote |
| HY5V56FFP-H | 1,428 | 200746+ | Get Quote |
| HY5V56FFP-H-C | 2,999 | 200846+ | Get Quote |
| HY5V56FFP-H | 6,000 | Get Quote | |
| HY5V56FFP-H-A | 11,200 | Get Quote | |
| HY5V56FFP-H-C | 1,384 | 2010 | Get Quote |