K4AAG165WB-BCWE
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | K4AAG165WB-BCWE |
| Hersteller | SAMSUNG |
| Produktkategorie | DDR4 SDRAM |
| IC-Code | 1GX16 DDR4 |
Produktbeschreibung
| Gehäuse | FBGA-96 |
| Verpackung | TRAY |
| RoHS | RoHS |
| Spannungsversorgung | 1.2 V |
| Betriebstemperatur | 0 C~+85 C |
| Geschwindigkeit | 3200 MBPS |
| Standard Stückzahl | 1120 |
| Abmessungen Karton | |
| Number Of Words | 1G |
| Bit Organization | x16 |
| Density | 16Gb |
| Internal Banks | 16 Banks |
| Power | Normal Power |
| Generation | 3rd Generation |
Verfügbare Angebote
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| K4AAG165WB-BCWE | 17.920 | 25+ | Anfrage senden |
| K4AAG165WB-BCWE | 1.800 | Anfrage senden | |
| K4AAG165WB-BCWE | 0 | Anfrage senden | |
| K4AAG165WB-BCWE | 30.000 | Anfrage senden | |
| K4AAG165WB-BCWE | 508 | 23+ | Anfrage senden |
| K4AAG165WB-BCWE | 10.000 | Anfrage senden | |
| K4AAG165WB-BCWE | 1 | 21＋ | Anfrage senden |
| K4AAG165WB-BCWE | 11.200 | Anfrage senden | |
| K4AAG165WB-BCWE | 44.800 | Anfrage senden | |
| K4AAG165WB-BCWE | 680 | 21+ | Anfrage senden |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| H5ANAG6NCJR-XNC | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| H5ANAG6NCJR-XNC FBGA | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| H5ANAG6NCJR-XNC/16GB DDR4 SDRA | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| H5ANAG6NCJR-XNCR | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| H5ANAG6NCMR-WMC | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| H5ANAG6NCMR-XNC | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| H5ANAG6NDMR-XNC | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| H5ANAG6NDMR-XNCR | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| K4AAG164WA-BCWE | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| K4AAG165WA-BCWE | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |