Bilder dienen nur der Illustration
Hersteller-Nummer | K4AAG165WB-BCWE |
Hersteller | SAMSUNG |
Produktkategorie | DDR4 SDRAM |
IC-Code | 1GX16 DDR4 |
Gehäuse | FBGA-96 |
Verpackung | TRAY |
RoHS | RoHS |
Spannungsversorgung | 1.2V |
Betriebstemperatur | 0 C~+85 C |
Geschwindigkeit | 3200 MBPS |
Standard Stückzahl | 1120 |
Abmessungen Karton | |
Number Of Words | 1G |
Bit Organization | x16 |
Density | 16Gb |
Internal Banks | 16 Banks |
Generation | 3rd Generation |
Power | Normal Power |
Teilenummer | Menge | Datecode | |
---|---|---|---|
K4AAG165WB-BCWE | 680 | 21+ | Anfrage senden |
K4AAG165WB-BCWE | 15.360 | 23+ | Anfrage senden |
K4AAG165WB-BCWE | 20.000 | Anfrage senden | |
K4AAG165WB-BCWE | 50.000 | Anfrage senden | |
K4AAG165WB-BCWE | 50.000 | 23+ | Anfrage senden |
K4AAG165WB-BCWE | 100.000 | 22+ | Anfrage senden |
K4AAG165WB-BCWE | 100.000 | Anfrage senden | |
K4AAG165WB-BCWE | 20.000 | 2022+ | Anfrage senden |
K4AAG165WB-BCWE | 946 | 2021+ | Anfrage senden |
K4AAG165WB-BCWE | 800 | 21+ | Anfrage senden |
Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
---|---|---|---|---|
H5ANAG6NCJR-XNC | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
H5ANAG6NCJR-XNCR | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
H5ANAG6NCMR-WMC | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
H5ANAG6NCMR-XNC | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
H5ANAG6NDMR-XNC | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
H5ANAG6NDMR-XNCR | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
K4AAG165WA-BCWE | FBGA-96 | 1.2V | 3200 MBPS | 0 C~+85 C |
K4AAG165WA-BCWE0 | FBGA-96 | 1.2V | 3200 MBPS | 0 C~+85 C |
K4AAG165WA-BCWE000 | FBGA-96 | 1.2V | 3200 MBPS | 0 C~+85 C |
K4AAG165WA-BCWE00P | FBGA-96 | 1.2V | 3200 MBPS | 0 C~+85 C |