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| Manufacturer Part No | K4AAG165WB-BCWE |
| Brand | SAMSUNG |
| Item | DDR4 SDRAM |
| Part No | 1GX16 DDR4 |
| Package | FBGA-96 |
| Outpack | TRAY |
| RoHS | RoHS |
| Voltage | 1.2 V |
| Temperature | 0 C~+85 C |
| Speed | 3200 MBPS |
| Std. Pack Qty | 1120 |
| Std. Carton | |
| Number Of Words | 1G |
| Bit Organization | x16 |
| Density | 16Gb |
| Internal Banks | 16 Banks |
| Power | Normal Power |
| Generation | 3rd Generation |
| Description | Qty | Datecode | |
|---|---|---|---|
| K4AAG165WB-BCWE | 17,920 | 25+ | Get Quote |
| K4AAG165WB-BCWE | 1,800 | Get Quote | |
| K4AAG165WB-BCWE | 0 | Get Quote | |
| K4AAG165WB-BCWE | 30,000 | Get Quote | |
| K4AAG165WB-BCWE | 508 | 23+ | Get Quote |
| K4AAG165WB-BCWE | 10,000 | Get Quote | |
| K4AAG165WB-BCWE | 1 | 21+ | Get Quote |
| K4AAG165WB-BCWE | 11,200 | Get Quote | |
| K4AAG165WB-BCWE | 44,800 | Get Quote | |
| K4AAG165WB-BCWE | 680 | 21+ | Get Quote |
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| H5ANAG6NCJR-XNC | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| H5ANAG6NCJR-XNC FBGA | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| H5ANAG6NCJR-XNC/16GB DDR4 SDRA | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| H5ANAG6NCJR-XNCR | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| H5ANAG6NCMR-WMC | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| H5ANAG6NCMR-XNC | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| H5ANAG6NDMR-XNC | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| H5ANAG6NDMR-XNCR | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| K4AAG164WA-BCWE | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| K4AAG165WA-BCWE | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |