K4AAG165WB-BCWE
产品概述
图片仅供参考
| 制造商IC编号 | K4AAG165WB-BCWE |
| 厂牌 | SAMSUNG/三星 |
| IC 类别 | DDR4 SDRAM |
| IC代码 | 1GX16 DDR4 |
产品详情
| 脚位/封装 | FBGA-96 |
| 外包装 | TRAY |
| 无铅/环保 | 无铅/环保 |
| 电压(伏) | 1.2V |
| 温度规格 | 0 C~+85 C |
| 速度 | 3200 MBPS |
| 标准包装数量 | 1120 |
| 标准外箱 | |
| Number Of Words | 1G |
| Bit Organization | x16 |
| Density | 16Gb |
| Internal Banks | 16 Banks |
| Generation | 3rd Generation |
| Power | Normal Power |
供应链有货
| IC 编号 | 数量 | 生产年份 | |
|---|---|---|---|
| K4AAG165WB-BCWE | 680 | 21+ | 索取报价 |
| K4AAG165WB-BCWE | 15,360 | 23+ | 索取报价 |
| K4AAG165WB-BCWE | 20,000 | 索取报价 | |
| K4AAG165WB-BCWE | 50,000 | 索取报价 | |
| K4AAG165WB-BCWE | 50,000 | 23+ | 索取报价 |
| K4AAG165WB-BCWE | 100,000 | 22+ | 索取报价 |
| K4AAG165WB-BCWE | 100,000 | 索取报价 | |
| K4AAG165WB-BCWE | 20,000 | 2022+ | 索取报价 |
| K4AAG165WB-BCWE | 946 | 2021+ | 索取报价 |
| K4AAG165WB-BCWE | 800 | 21+ | 索取报价 |
FFFE/互通料号 (形式，腳位和功能对等)
| IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
|---|---|---|---|---|
| H5ANAG6NCJR-XNC | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| H5ANAG6NCJR-XNCR | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| H5ANAG6NCMR-WMC | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| H5ANAG6NCMR-XNC | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| H5ANAG6NDMR-XNC | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| H5ANAG6NDMR-XNCR | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| K4AAG165WA-BCWE | FBGA-96 | 1.2V | 3200 MBPS | 0 C~+85 C |
| K4AAG165WA-BCWE0 | FBGA-96 | 1.2V | 3200 MBPS | 0 C~+85 C |
| K4AAG165WA-BCWE000 | FBGA-96 | 1.2V | 3200 MBPS | 0 C~+85 C |
| K4AAG165WA-BCWE00P | FBGA-96 | 1.2V | 3200 MBPS | 0 C~+85 C |