Package | TSOP2 |
Outpack | TRAY |
RoHS | Leaded |
Voltage | 3.3 V |
Temperature | 0 C~+70 C |
Speed | 166 MHZ |
Std. Pack Qty | |
Std. Carton | |
Number Of Words | 1M |
Bit Organization | x16 |
Density | 16M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 2 banks |
Die Generation | 4th Gen. |
Power Consumption | normal power |
Shipping Method | tray |
Description | Package | Voltage | Speed | Temperature |
---|---|---|---|---|
AS4C1M16S-6TCN | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
AS4C1M16S-6TCNTR | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
EDS1616AGTA-6BE | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V16160DTC-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V16160ET-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V16160ETP-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V16160TC-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V161610BCT-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V161610BTC-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V161610CTC-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |