Package | TSOP2 |
Outpack | TRAY |
RoHS | Leaded |
Voltage | 3.3 V |
Temperature | 0 C~+70 C |
Speed | 166 MHZ |
Std. Pack Qty | |
Std. Carton | |
Number Of Words | 1M |
Bit Organization | x16 |
Density | 16M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 2 banks |
Die Generation | 4th Gen. |
Power Consumption | normal power |
Shipping Method | tray |
Description | Package | Voltage | Speed | Temperature |
---|---|---|---|---|
HY57V161610DCT-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V161610DT-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V161610DTC-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V161610DTC-6(1X16) | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V161610DTC-7/6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V161610DTC-8(1X16) | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V161610DTC-8/-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V161610DTC-8/7/6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V161610ET-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V161610ET-7 #160 #16 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |