| Package | stack package(others) |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.3 V |
| Temperature | 0 C~+70 C |
| Speed | 166 MHz |
| Std. Pack Qty | |
| Std. Carton | |
| Density | 16M |
| Hynix Memory | HY |
| Die Generation | 3rd Gen. |
| Power Consumption | normal power |
| Shipping Method | tray |
| Description | Qty | Datecode | |
|---|---|---|---|
| HY57V16164BJC-60 | 62,000 | 98+ | Get Quote |