K4B2G0846Q-HCH9
Product Overview
Images are for reference only
| Manufacturer Part No | K4B2G0846Q-HCH9 |
| Brand | SAMSUNG |
| Item | DDR3 SDRAM |
| Part No | 256MX8 DDR3 |
Product Details
| Package | FBGA-78 |
| Outpack | |
| RoHS | RoHS |
| Voltage | 1.5 V |
| Temperature | 0 C~+85 C |
| Speed | 1333 MBPS |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 256M |
| Bit Organization | x8 |
| Density | 2G |
| Internal Banks | 8 Banks |
| Generation | 17th Generation |
| Power | Normal Power |
FFFE (Form, Fit & Functional Equivalents)
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| K4B2G0846D-HCH9000 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846D-HCH90S3 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846D-HCH9T | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846D-HCH9T00 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846D-HCH9TCV | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846D-HYH9 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846D-HYH9 IC | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846E-BCH9 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846E-H9 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846E-MCH9 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |