K4S563233F-HN75 PB FREE

Product Overview

IC Picture

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Manufacturer Part No K4S563233F-HN75 PB FREE
Brand SAMSUNG
Item SDRAM
Part No 8MX32 SD

Product Details

Package FBGA
Outpack
RoHS RoHS
Voltage 3.3 V
Temperature -40 C~+125 C
Speed 133 MHZ
Std. Pack Qty
Std. Carton
Number Of Words 8M
Bit Organization x32
Density 256M
Internal Banks 4 Banks
Power Low, i-TCSR
Generation 7th Generation

Available Offers

Description Qty Datecode
K4S563233F-HN75 PB FREE 5,000 04 Get Quote

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
K4S563232F-HN75 FBGA 3.3 V 133 MHZ -40 C~+125 C
K4S563233F-HN75 FBGA 3.3 V 133 MHZ -40 C~+125 C
K4S563233F-HN75000 FBGA 3.3 V 133 MHZ -40 C~+125 C
K4S563233F-HN750JR FBGA 3.3 V 133 MHZ -40 C~+125 C
K4S563233F-HN75T00 FBGA 3.3 V 133 MHZ -40 C~+125 C
K4S563233FHN7500 FBGA 3.3 V 133 MHZ -40 C~+125 C
K4S56323FHN75 FBGA 3.3 V 133 MHZ -40 C~+125 C
K4S56323LF-HN75 FBGA 3.3 V 133 MHZ -40 C~+125 C