图片仅供参考
制造商IC编号 | K4G80325FC-HC25 |
厂牌 | SAMSUNG/三星 |
IC 类别 | GDDR5 SDRAM |
IC代码 | 256MX32 GDDR5 |
共通IC编号 | K4G80325FC-HC25000 |
K4G80325FC-HC25T00 |
脚位/封装 | FBGA-170 |
外包装 | TRAY |
无铅/环保 | 无铅/环保 |
电压(伏) | 1.35V/1.5V |
温度规格 | 0 C~+85 C |
速度 | 8.0 GBPS |
标准包装数量 | 1120 |
标准外箱 | |
Bit Organization | x32 |
Internal Banks | 16 Banks |
Generation | 4th Generation |
Power | Normal Power |
IC 编号 | 数量 | 生产年份 | |
---|---|---|---|
K4G80325FC-HC25 | 100,000+ | 索取报价 | |
K4G80325FC-HC25 | 12,320 | 索取报价 | |
K4G80325FC-HC25 | 5,000 | 20+ | 索取报价 |
K4G80325FC-HC25000 | 13,440 | 21+ | 索取报价 |
K4G80325FC-HC25T00 | 12,000 | 21+ | 索取报价 |
K4G80325FC-HC25 | 30,000 | 21+ | 索取报价 |
K4G80325FC-HC25000 | 20,000 | 20+ | 索取报价 |
K4G80325FC-HC25 | 100,000+ | 索取报价 | |
K4G80325FC-HC25 | 8,880 | 2021/10 | 索取报价 |
K4G80325FC-HC25000 | 10,000 | 20+ | 索取报价 |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
H5GC8H24AJR-R2C | FBGA-170 | 1.35V | 0 C~+85 C |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
K4G80325FB-HC | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
K4G80325FB-HC03 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
K4G80325FB-HC22 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
K4G80325FB-HC24 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
K4G80325FB-HC25 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
K4G80325FB-HC25000 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
K4G80325FB-HC25T00 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
K4G80325FB-HC28 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
K4G80325FB-HC28 D5 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
K4G80325FB-HC28 D5 25 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |