K4H561638FDGCB3
Product Overview
Images are for reference only
| Manufacturer Part No | K4H561638FDGCB3 |
| Brand | SAMSUNG |
| Item | DDR1 SDRAM |
| Part No | 16MX16 DDR1 |
Product Details
| Package | FBGA |
| Outpack | |
| RoHS | Leaded |
| Voltage | 2.5 V |
| Temperature | -25 C~+85 C |
| Speed | 166 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 16M |
| Bit Organization | x16 |
| Density | 256M |
| Internal Banks | 4 Banks |
| Power | Low, i-TCSR & PASR & DS |
| Generation | 7th Generation |
Available Offers
| Description | Qty | Datecode | |
|---|---|---|---|
| K4H561638FDGCB3 | 2,000 | 2005+ | Get Quote |
FFFE (Form, Fit & Functional Equivalents)
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| EDD25163HBH-6ELS-F | FBGA | 2.5 V | 166 MHZ | -25 C~+85 C |